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| Our comprehensive manufacturing experience
allows you to leverage our strength in: |
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• |
RoHS-compliant and cleanroom
manufacturing processes |
| • |
Complex manufacturing
using consigned equipment and materials |
| • |
Complete turnkey
manufacturing with multiple materials sourcing
sites |
| • |
ERP-based planning,
purchasing, and manufacturing processes |
| • |
Strategic partnerships with
leading materials distributors and manufacturers |
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| |
We have the essential infrastructure,
equipment, manpower and quality systems to assure
you of quick start of operations and turnaround
time.
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MATERIALS
MANAGEMENT
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• |
Materials sourcing |
| • |
Materials procurement |
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Materials control
and production control |
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| |
PCBA AND FPCA ASSEMBLY
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• |
Flexible, aluminum
and ceramic PCBAs |
| • |
Flip chip |
| • |
Chip-on-Board (COB) |
| • |
Chip-on-Flex (COF) |
| • |
Chip-on-Glass (COG) |
| • |
Chip-scale packaging |
| • |
Automated SMT manufacturing |
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| |
AUTOMATED
THROUGH-HOLE ASSEMBLY
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• |
Automatic component
insertion |
| • |
Solder wave (lead-free
and eutectic) |
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COMPLETE BOX
BUILD SOLUTIONS
| • |
Storage devices |
| • |
Power electronics
products for various applications |
| • |
Communication devices |
| • |
Short-range wireless
connectivity devices |
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• |
Other electronic
products (consumer, industrial, automotive,
medical) |
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| |
SUB-ASSEMBLY
SERVICES
| • |
Hard Disk Drive
(HDD) sub-assemblies |
| • |
Optical Disk Drive
(ODD) sub-assemblies |
| • |
Power electronic
sub-assemblies for various applications |
| • |
Liquid Crystal Displays
(LCDs) |
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• |
Other sub-assemblies
(consumer, industrial, automotive, medical) |
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| |
COMPONENT
ASSEMBLY AND MANUFACTURE OF ENCLOSURE SYSTEMS
| • |
Transistors |
| • |
Hybrid ICs |
| • |
Surface Acoustic
Wave (SAW) filters |
| • |
Light Emitting Diodes
(LEDs) |
| • |
Metal stamping |
| • |
Plastic injection |
| • |
Plastic vacuum forming |
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| |
TEST SERVICES
| • |
In-circuit test |
| • |
Burn-in test |
| • |
Functional/parametric
test |
| • |
Automated Optical
Inspection (AOI) |
| • |
Automated X-ray
inspection |
| • |
Environmental test |
| • |
Thermal shock test |
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• |
Temperature humidity
test |
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| |
FAILURE ANALYSIS
AND CALIBRATION SERVICES
| • |
Fault/board level
analysis |
| • |
Component/surface
analysis |
| • |
SEM/EDX, SAM, IR,
camera, microsetting, and FTIR |
| • |
Ionic/contamination
analysis |
| • |
Inspection measuring
and test equipment calibration |
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• |
Thermometry, electrical,
mechanical and dimensional calibration |
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