 |
| IMI USA is located in Tustin, California as direct
support to IMI’s North American customers.
It provides Program Management and Customer Service
locally. Founded in 1987 as Smartflex Systems,
it was acquired by Saturn Electronics & Engineering
in 1999. In 2005, IMI acquired Saturn’s assets
in Tustin along with its Cebu, Philippines facilities. |
| Experience and Capabilities |
| • Prototype and Engineering Development |
| • Transfer High Volume Production
Off-Shore |
| • New
Product Introduction Management |
| |
| Precision
Assembly |
| • Substrates: Flex Circuits,
PCBs; Ceramics |
| • High Component Density |
| |
• Small SMD and fine pitch |
| |
|
• 0201 and larger |
| |
|
• MicroBGA; CSP packages; TQFP;
TSOIP |
| |
• Direct Die Attach |
| |
|
• Chip-On-Flex |
| |
|
• Flip Chip On Flex |
| • Integrate Flex for complete
substrate interconnect solution |
| • Very Precise Component Placement |
| |
| IMI
USA, Inc. |
| Contact
Person: |
Richard
Bell
Vice President for Sales |
| Address: |
IMI
USA
14312 Franklin Avenue
Suite A, Tustin, CA 92780
USA |
Tel.No.
Fax : |
+1-714-734-7043
+1-714-838-8787 |
| E-mail: |
DBell@imiphil.com |
| |
| |
Read the article “The High-Speed,
Low-Cost, Lead-Free Challenge for Flip Chips”
by Tim Patterson, I.M.I. USA
Flip-chip onto organic substrates has become
a mature process with a stable infrastructure.
It is more reliable and, for high-volume
applications, less expensive than chip on
board, and is approaching cost parity with
surface-mount technology. Its superior electrical
performance is also required for many high-speed
applications but challenges remain. An article
by Tim Patterson, IMI USA on Semiconductor
International at http://www.reed-electronics.com. |
