IMI was established in 1980 as a joint venture between Ayala Corporation and Resins Inc. With more than 25 years of experience in the industry, IMI has an established expertise in comprehensive manufacturing capabilities and higher value services for the storage device, communications, industrial, consumer, and automotive electronics markets.

IMI has received numerous awards and accolades from its global customers. It also obtained the awards for Manufacturing Quality and Dependability/Timely Delivery for Medium-Sized EMS Companies in Circuits Assembly’s Service Excellence Awards 2006 based on customers’ survey responses. These, along with long-term business partnerships nurtured through the years, are clear evidence of the high level of customer satisfaction that IMI is able to maintain

IMI’s facilities in the Philippines are located in Laguna and Cebu. They offer a wide range of services such as PCBA, Flip chip assembly, Box build, Sub-assembly, and Enclosure system manufacturing.

IMI has a prototyping and engineering center in North America located in Tustin, California. It is at the forefront of technology with regard to precision assembly capabilities including SMT, Chip on Flex (COF), Chip on Board (COB), and Flip chip on flex.

Through its Tustin facility, IMI has acquired three US patents for advanced manufacturing, two for Traceless Flip Chip Assembly and Method, and one for Manufacturing Method for Attaching Components to a Substrate. The patented Pre-Flow Underfill Flip Chip Assembly and Method, allows application of the underfill material to the substrate before the chip is assembled rather than after assembly. This innovative method speeds up the chip assembly process while efficiently maintaining control over flux application.